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Gigabyte H252-3C0 Server - System Overview

The 3rd gen Intel Xeons feature an 8-channel memory architecture to support 8x memory module slots on each node. With all nodes combined, there are 32x DIMM slots for up to 8TB of DDR4 memory running at speeds of up to 3200MHz. All server nodes can be managed from the Chassis Management Controller (CMC) global management port. This hyper-converged system is ideal for edge computing, remote data center management, and file storage.

Gigabyte H252-3C0 rear nodesGigabyte H252-3C0 node

Gigabyte H252-3C0 Server - Specifications

Processor - 1 Socket (Per node)

  • 3rd Generation Intel® Xeon® Scalable Processors
  • Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
  • 10nm technology, CPU TDP up to 270W
  • Socket (Per Node):

  • 1 x LGA 4189, Socket P+
  • Chipset:

  • Intel C621A Chipset

Motherboard

  • MH12-HD0

Memory (Per node)

    Memory Slots

  • 8x DDR4 DIMM slots
  • 8-Channel memory architecture
  • Memory Type

  • RDIMM
  • LRDIMM
  • 3DS LRDIMM
  • 3DS RDIMM
  • Memory Speed

  • Up to 3200MHz
  • DIMM Module Sizes

  • RDIMM/LRDIMM: Up to 128GB
  • 3DS RDIMM/3DS LRDIMM: Up to 256GB

Drive Bays (Per node)

  • 3x 3.5" or 2.5" SATA/SAS hot-swappable SSD bays
  • 1x SATA DOM

LAN (Per node)

  • 2 x 1GbE LAN ports (1 x Intel® I350-AM2)
  • 1 x Dedicated management port
  • Video

  • Integrated in Aspeed AST2500
  • 2D Video Graphic Adapter with PCIe bus interface
  • 1920x1200 @ 60Hz 32bpp, DDR4 SDRAM
  • Management chip on CMC board: Integrated Aspeed AST2520A2-GP

Input / Output (Per node)

    Internal

  • 1 x USB 3.0 header
  • 1 x SATA DOM
  • 1 x TPM header
  • 1 x OCP 2.0 mezzanine slots
  • 1 x Front panel header
  • 1 x Back plane board header
  • 1 x IPMB connector
  • 1 x Clear CMOS jumper
  • 1 x BIOS recovery jumper
  • Front

  • 1 x Power button with LED
  • 1 x ID button with LED
  • 1 x Status LED
  • 1 x Reset button
  • Rear

  • 2 x USB 3.0
  • 1 x VGA
  • 2 x RJ45
  • 2 x MLAN
  • 1 x ID LED
  • TPM

  • 1 x TPM header with SPI interface
  • Optional TPM 2.0 kit: CTM010

Expansion Slots (Per node)

  • 2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
  • 1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth (Type 1, P1, P2 with NCSI supported)

Chassis

    Enclosure

    Height: 87.5mm (3.444 in)

    Width: 440mm (17.322 in)

    Depth: 695mm (27.362 in)

Power Supply

  • 2 x 1600W redundant 80 PLUS Platinum power supply

System Fans

  • 4 x 80x80x38mm (16,300rpm)

System Management

  • Aspeed AST2500 management controller
  • GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Gigabyte H252-3C0 Server - Documentation

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