The 4-node Gigabyte H261-Z60 server is a high-density platform powered by 8x AMD EPYC processors from the 7001, 7002, or 7003 series families. Depending on the revision, The CPUs will each provide 8x to 64x cores. An 8-channel memory architecture provides up to 8TB of memory when all 64x DDR4 DIMM slots are filled with 128GB RDIMM or LRDIMM memory modules. Each node supports 6x 2.5" SATA hot-swappable bays or 4x 2.5" SATA/SAS hot-swappable bays with a SAS RAID Card, for a total of 24x 2.5” drive bays in the 2U chassis.
Under the hood, the motherboard has 2x M.2 PCIe Gen3 x4 slots for cards in the 2242, 2260, 2280, and 22110 form factors. The maximum CPU TDP while utilizing an M.2 device is 120W as opposed to 200W. Designed for Hyper-converged Infrastructure (HCI), hybrid and Private Cloud applications, the H261-Z60 server is powered by a dual 2200W 80 PLUS Platinum redundant power supply. At 2U, each node offers 2x low-profile PCIe Gen3 x16 slots, as well as 1x OCP mezzanine slot with PCIe Gen3 x16 bandwidth.
Gigabyte's management software provides Administrators access to sensors, event logs, remote access, and more, and are accessible through the pre-installed Gigabyte management portal (AMI MegaRAC SP-X). An Aspeed CMC (Central Management Controller) is included with Gigabyte's High-Density series servers for chassis-level management and node-level monitoring. Because only one MLAN connection is required to monitor all 4x nodes, less Top of Rack (ToR) cabling and switch connections are required. Each of the server nodes also has a dedicated RJ45 management port.
Gigabyte H261-Z60 Server - Specifications
Processor - 2 Sockets (per node)
Dual Processor per node
Socket: 2x LGA 4094
7001, 7002, 7003 series AMD EPYC processors
Up to 64-core, 128 threads per processor
TDP up to 200W
Chipset:
System on Chip
Motherboard
MZ61-HD0
Memory (per node)
Memory Slots
16x DDR4 DIMM slots
8-Channel memory architecture
Memory Speed
Memory speed: 3200/2933 MHz
DIMM Module Sizes
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Drive Bays (per node)
6 x 2.5" SATA hot-swappable bays OR
4 x 2.5" SATA/SAS hot-swappable bays with SAS RAID Card
LAN (per node)
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
1 x 10/100/1000 *CMC port
Video
Integrated in Aspeed AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200 @ 60Hz 32bpp, DDR4 SDRAM
Input / Output (per node)
Internal
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Rear
2 x USB 3.0
1 x VGA
1 x RJ45
1 x RJ45 MLAN
1 x ID LED
Backplane
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Expansion Slots (per node)
2 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0
1 x M.2 slot: PCIe Gen3 x4, from CPU_0
Supports NGFF-2242/2260/2280/22110 cards
CPU TDP is limited to 120W if using M.2 device
1 x M.2 slot: PCIe Gen3 x4, from CPU_1
Supports NGFF-2242/2260/2280/22110 cards
CPU TDP is limited to 120W if using M.2 device
Chassis
Enclosure
Height: 87 mm
Width: 440 mm
Depth: 820 mm
Power Supply
2 x 2200W 80 PLUS Platinum redundant power supplies
System Fans
8 x 80x80x38mm (16,300rpm)
System Management
Aspeed AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
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Under the hood, the motherboard has 2x M.2 PCIe Gen3 x4 slots for cards in the 2242, 2260, 2280, and 22110 form factors. The maximum CPU TDP while utilizing an M.2 device is 120W as opposed to 200W. Designed for Hyper-converged Infrastructure (HCI), hybrid and Private Cloud applications, the H261-Z60 server is powered by a dual 2200W 80 PLUS Platinum redundant power supply. At 2U, each node offers 2x low-profile PCIe Gen3 x16 slots, as well as 1x OCP mezzanine slot with PCIe Gen3 x16 bandwidth.
