This is a high-density platform that supports 4x nodes accessible through the rear of the platform. The Gigabyte H262-Z66 server can be outfitted with dual AMD EPYC processors from the 7001, 7002, or 7003 series families offering 8x to 64x cores in each node. Processors features a TDP of up to 200W, depending on the revision. A total of 24x drive bays on the front panel of this system, include 12x 2.5" NVMe/SATA hot-swappable SSD bays and 12x 2.5" SATA/SAS hot-swappable HDD/SSD bays split between the 4x nodes.
The 2U Gigabyte H262-Z66 server offers numerous helpful components for high-performance computing, hyperconverged infrastructure, and hybrid/private cloud server applications. Each H262-Z66 node can be managed individually using web interface of the GIGABYTE Management Console (AMI MegaRAC SP-X) which leverages the integrated the Aspeed AST2500 management controller. Gigabyte’s H-series servers also offer a Chassis Management Controller or CMC for multi-node management and less cable clutter. CMC also offers the ability to create a ring connection for managing and monitoring all servers in a rack.
Each node has 16x DIMM slots that can hold up to 4TB of DDR4 memory and an 8-memory channel processor architecture. In total, the system can accommodate up to 16TB of RAM and 64x DDR4 DIMM slots. For future expansion, each node also has 2x low-profile PCIe Gen4 x16 expansion slots and 1x OCP 2.0 Gen4 x16 mezzanine slot. Dual M.2 PCIe Gen3 x4 slots in each node can be outfitted with 2242, 2260, 2280, or 22110 cards. Power is provided by dual redundant 2200W PSUs. There are two revisions of this system, which vary in processors and memory types.
Gigabyte H262-Z66 Server (rev. 100)
AMD EPYC 7001/7002 series processor family
RDIMM/LRDIMM modules up to 128GB supported
Gigabyte H262-Z66 Server (rev. A00)
AMD EPYC 7002/7003 series processor family
3DS RDIMM/LRDIMM modules up to 256GB supported
Gigabyte H262-Z66 Server - Specifications
Processor - 2 Sockets
(rev.100): AMD EPYC™ 7001/7002 series processor family
(rev.A00): AMD EPYC™ 7002/7003 series processor family
Dual processor, 7nm technology
2 x LGA 4094
Up to 64-core, 128 threads per processor
cTDP up to 200W, cTDP 240W CPU
Chipset:
System on Chip
Motherboard
MZ62-HD0
Memory (Per Node)
Memory Slots
16x DDR4 DIMM slots
8-Channel memory architecture
Memory Type
RDIMM
LRDIMM
3DS RDIMM
3DS LRDIMM
Memory Speed
Up to 3200 MHz
DIMM Module Sizes
RDIMM/LRDIMM: Up to 128GB
3DS RDIMM/3DS LRDIMM: Up to 256GB
Drive Bays (Per Node)
3 x 2.5" NVMe/SATA hot-swappable SSD bays
3 x 2.5" SATA/SAS hot-swappable HDD/SSD bays
LAN
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x 10/100/1000 management LAN
1 x dedicated management port
Video
Integrated in Aspeed AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200 @ 60Hz 32bpp, DDR4 SDRAM
Input / Output (Per Node)
Internal
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x IPMB connector
1 x Clear CMOS jumper
1 x PLD header
Front
1 x Power button with LED
1 x ID button with LED
1 x System Reset Button
1 x STatus LED
Rear
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
Backplane I/O
24 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port
TPM
1 x TPM header with SPI interface
Optional TPM 2.0 kit: CTM010
Expansion Slots
2 x Low profile half-length slot with PCIe x16 (Gen4 x16 bus) from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
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