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Lenovo ThinkSystem HX630 V3

Outfitted with 2x 4th or 5th generation Intel Xeon Scalable processors with 8-channel memory architecture, the Lenovo ThinkAgile HX630 V3 features 32x memory module slots for up to 2x DIMMs per Channel (2DPC). At 1U, the front of the system offers support for 4x 3.5-inch or up to 10x 2.5-inch storage bays, depending on your workload. Drive types supported include SAS, SATA, and NVMe storage devices. CPUs supported on this system are restricted to a thermal design power rating of up to 350W.
Lenovo ThinkSystem HX630 V3 side view
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Lenovo ThinkSystem HX630 V3 - System Overview

Additional Information

ThinkAgile HX630 V3 front

The Lenovo ThinkAgile HX630 V3 comes in 3x different configurations each with slightly different system features. Depending on the system configuration, the system will support 8 to 4TB of DDR5 memory. The system can also be outfitted with up 2x M.2 drives that can be used to boot they system. All configurations can support up to 2x single-wide GPUs.

System Configurations

  • HX630 V3 ROBO Integrated System and HX630 V3 ROBO Certified Node: Front drive bays: 4x 3.5-inch SAS/SATA, Rear drive bays: 2x 2.5-inch (optional), 8TB of DDR5 memory
  • HX630 V3 Integrated System and HX630 V3 Certified Node: Front drive bays: 10x 2.5-inch AnyBay or 10x 2.5-inch NVMe, Rear drive bays: 2x 2.5-inch SAS/SATA or 2x2.5" NVME (optional), 8TB of DDR5 memory
  • HX630 V3 Integrated System and Certified Node for SAP HANA: Front drive bays: 10x 2.5-inch AnyBay or 10x 2.5-inch NVMe, Internal M.2 module supporting up to two M.2 drives, for OS boot support, 4TB of DDR5 memory

Note: EDSFF drive bays are currently not supported. Lenovo HX630 V3 Nodes rear

A dedicated port on the back of the system is compatible with standard management protocols including IPMI 2.0, SNMP 3.0, Redfish REST API and serial console via IPMI. There are several options for PCIe expansion based on the rear riser selection and the additional of the 2-bay, 2.5-inch drive cage in back. Up to 3x PCIe 5.0 or PCIe 4.0 slots are supported, plus a dedicated OCP mezzanine card slot. A dedicated area on the system board can be outfitted with a RAID adapter or host Bus Adapter (HBA) and will not take away any of the PCIe slots. For managing the system, Lenovo offers XClarity, which accesses the Lenovo XClarity Controller II (XCC2), which also offers the XClarity Provisioning Manager, and the XClarity Administrator Mobile app.

Lenovo ThinkSystem HX630 V3 - Specifications

Processors - 2 Sockets

  • 4th Gen Intel Xeon Scalable processor
  • TDP up to 350W/ 60 cores and 120 threads

  • 5th Gen Intel Xeon Scalable processor
  • TDP up to 350W/ 64 cores and 128 threads

Memory

  • 32x DDR5 DIMM slots
  • 8 channels per CPU
  • Supports up to 8TB with 3DS RDIMMs 5600 MHz

Drive Bays

    HX630 V3 ROBO Integrated System and HX630 V3 ROBO Certified Node:

  • Front drive bays: 4x 3.5-inch SAS/SATA
  • Rear drive bays: 2x 2.5-inch (optional), 8TB of DDR5 memory

    • HX630 V3 Integrated System and HX630 V3 Certified Node (CN):

  • Front drive bays: 10x 2.5-inch AnyBay or 10x 2.5-inch NVMe
  • Rear drive bays: 2x 2.5-inch SAS/SATA or 2x2.5" NVME (optional), 8TB of DDR5 memory

    • HX630 V3 Integrated System and Certified Node (CN) for SAP HANA:

  • Front drive bays: 10x 2.5-inch AnyBay or 10x 2.5-inch NVMe

  • Internal M.2 module supporting up to two M.2 drives, for OS boot support, 4TB of DDR5 memory

Power Supplies

  • Up to 2x hot-swap redundant AC power supplies, 80 PLUS Platinum or 80 PLUS Titanium certification
  • 750W, 1100W and 1800W AC options, supporting 220 V AC
  • 750W and 1100W options also support 110V input supply

Cooling

  • Up to 8x N+1 redundant hot swap 40 mm fans, configuration dependent. One fan integrated in each power supply

Expansion Slots

    Four choices for rear-access slots:

  • 3x PCIe 4.0 x16 low-profile slots
  • 1x PCIe 4.0 x16 full-height half-length slot + 1x PCIe 4.0 x16 low-profile slot
  • 1x PCIe 4.0 x16 low-profile slot (also supports 2x rear 2.5-inch drive bays)
  • 2x PCIe 4.0 x16 low-profile slot (also supports 2x rear 2.5-inch drive bays)

GPU Support

  • Up to 2x single-wide GPUs

Dimensions

  • Width: 440 mm (17.3 in.)
  • Height: 43 mm (1.7 in.)
  • Depth: 773 mm (30.4 in.)
  • Weight: Maximum: 26.3 kg (58 lb)

Network Interface

  • Dedicated OCP 3.0 SFF slot with PCIe 5.0 x16 host interface
  • Supports a variety of 2-port and 4-port adapters with 10GbE and 25GbE network connectivity
  • 1Gbe port for XClarity Controller 2 (XCC2) management

Management

  • Lenovo XClarity Controller (XCC)

Lenovo ThinkSystem HX630 V3 - Documentation

Lenovo ThinkAgile HX630 V3 Product Guide Lenovo ThinkAgile HX Series User Guide
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