The Lenovo ThinkSystem SR675 V3 is a 3U, 2-socket server built on 4th generation AMD EPYC processors. CPUs supported on this system can have a TDP of up to 360W, and provide 16 to 96 Zen 4 cores. Depending on the model configuration, the system will support up to 8x bays, either SAS, SATA or NVMe 2.5-inch hot-swap or up to 6x hot-swap EDSFF drives. If all 24x DDR5 DIMM slots are populated with 128GB memory modules, the system can deliver up to 3TB of RAM with a maximum frequency of 4800MHz. Additionally, this 3U GPU system is designed to support a broad range of NVIDIA Hopper, Lovelace, and Ampere datacenter products, as well as AMD Instinct MI Series Accelerators.
Overview
Specifications
Documentation
Overview
Lenovo ThinkSystem SR675 V3 Server - System Overview
This machine can support up to 8x double-wide GPUs including the new NVIDIA H100 and L40 Tensor Core GPUs, or up to 4x SXM5 NVIDIA HGX H100 GPUs with NVLink connecting all GPUs. The NVIDIA HGXTM H100 GPUs' heat is dissipated via a specialized closed-loop liquid-to-air heat exchanger that offers liquid cooling advantages of lower power consumption, quieter operation, and higher performance without requiring additional piping.
Up to 6x SD665 V3 dual node trays can fit inside a single 6U ThinkSystem DW612S enclosure. The enclosure houses up to 144 processors, 216 TB of DDR5 Memory, and up to 144x PCIe Gen5 x16 adapters on just two data center floor tiles with up to 6x chassis in a conventional 42U rack.
Base Module
Up to 4x double-wide, full-height, full-length; FHFL GPUs; PCIe Gen5 x16
Up to 8x 2.5” Hot Swap SAS/SATA/NVMe
Dense Module
Up to 8x double-wide, full-height, full-length GPUs each PCIe Gen5 x16 on PCIe switch
Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
HGX Module
NVIDIA HGXTM H100 4-GPU with 4x NVLink connected SXM5 GPUs
Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
Specifications
Lenovo ThinkSystem SR675 V3 Server - Specifications
Processors - Dual Socket
1x or 2x 4th Generation AMD EPYC Processors per node
TDP up to 400W
Up to 96 cores/ 192 threads
Memory
24x DDR5 DIMMs
12 channels per CPU with 1DPC
Maximum 3TB using 128GB RDIMMs
Up to 4800 MHz
Drive Bays Per Module
Base Module
Up to 8x 2.5” Hot Swap SAS/SATA/NVMe
Dense Module
Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
HGX Module
Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
Power Supplies
Four N+N redundant hot-swap PSUs (up to 2600W Titanium)
Full ASHRAE A2 support with internal fans and Lenovo Neptune liquid-to-air hybrid cooling on NVIDIA HGX H100
Ports
Front
SXM5 model, 4-DW GPU model, and 8-DW GPU model with rear I/O slots: 1x USB 3.1 G1 (5Gb/s) port, 1x USB 2.0 port (also for XCC local management), External diagnostics port, VGA port
8-DW GPU model with front I/O slots: No front ports
Rear
All models: 3x USB 3.1 G1 (5 Gb/s) ports, 1x VGA video port, 1x RJ-45 1GbE systems management port for XCC remote management
Models with rear I/O slots: Optional DB-9 COM serial port (installs in a slot)
Internal
All models: 1x USB 3.1 G1 connector for operating system or license key purposes
Expansion Slots
Up to 6x PCIe Gen5 x16 adapters (2 front, 4 rear)
1x OCP NIC 3.0 (x16/x8/x4) (rear) depending on the configuration
GPUs
Supports up to 8x double-wide PCIe GPUs or 4x SXM5 GPUs, depending on the configuration:
SXM5 model:
4x SXM5 GPUs (@600W/GPU) with Lenovo Neptune liquid-to-air cooling and 4x 2.5-inch drive bays or 4x EDSFF E3.S 1T NVMe SSDs
4-DW GPU model:
4x double-wide GPUs with 8x 2.5-inch drive bays
8-DW GPU model:
8x double-wide GPUs with 6x EDSFF E1.S NVMe SSDs or 4x EDSFF E3.S 1T NVMe SSDs
Dimensions
Height: 131 mm (5.2 inches)
Width: 448 mm (17.6 inches)
Depth: 892 mm (35.1 inches)
Approximate weight, dependent on the configuration selected:
SXM5 model: 39.5 kg (87 lb)
4-DW GPU model: 36.7 kg (81 lb)
8-DW GPU model: 39 kg (86 lb)
Management
Lenovo XClarity Controller
Documentation
Lenovo ThinkSystem SR675 V3 Server - Documentation
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