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Lenovo ThinkSystem SR675 V3 Server - System Overview

This machine can support up to 8x double-wide GPUs including the new NVIDIA H100 and L40 Tensor Core GPUs, or up to 4x SXM5 NVIDIA HGX H100 GPUs with NVLink connecting all GPUs. The NVIDIA HGXTM H100 GPUs' heat is dissipated via a specialized closed-loop liquid-to-air heat exchanger that offers liquid cooling advantages of lower power consumption, quieter operation, and higher performance without requiring additional piping.

Up to 6x SD665 V3 dual node trays can fit inside a single 6U ThinkSystem DW612S enclosure. The enclosure houses up to 144 processors, 216 TB of DDR5 Memory, and up to 144x PCIe Gen5 x16 adapters on just two data center floor tiles with up to 6x chassis in a conventional 42U rack.

Base Module

  • Up to 4x double-wide, full-height, full-length; FHFL GPUs; PCIe Gen5 x16
  • Up to 8x 2.5” Hot Swap SAS/SATA/NVMe

Dense Module

  • Up to 8x double-wide, full-height, full-length GPUs each PCIe Gen5 x16 on PCIe switch
  • Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs

HGX Module

  • NVIDIA HGXTM H100 4-GPU with 4x NVLink connected SXM5 GPUs
  • Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
Lenovo ThinkSystem SR675 V3 Server configurations Lenovo ThinkSystem SR675 V3 Server front panel

Lenovo ThinkSystem SR675 V3 Server - Specifications

Processors - Dual Socket

  • 1x or 2x 4th Generation AMD EPYC Processors per node
  • TDP up to 400W
  • Up to 96 cores/ 192 threads

Memory

  • 24x DDR5 DIMMs
  • 12 channels per CPU with 1DPC
  • Maximum 3TB using 128GB RDIMMs
  • Up to 4800 MHz

Drive Bays Per Module

    Base Module

  • Up to 8x 2.5” Hot Swap SAS/SATA/NVMe
  • Dense Module

  • Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
  • HGX Module

  • Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs

Power Supplies

  • Four N+N redundant hot-swap PSUs (up to 2600W Titanium)

Cooling

  • Full ASHRAE A2 support with internal fans and Lenovo Neptune liquid-to-air hybrid cooling on NVIDIA HGX H100

Ports

    Front

  • SXM5 model, 4-DW GPU model, and 8-DW GPU model with rear I/O slots: 1x USB 3.1 G1 (5Gb/s) port, 1x USB 2.0 port (also for XCC local management), External diagnostics port, VGA port
  • 8-DW GPU model with front I/O slots: No front ports
  • Rear

  • All models: 3x USB 3.1 G1 (5 Gb/s) ports, 1x VGA video port, 1x RJ-45 1GbE systems management port for XCC remote management
  • Models with rear I/O slots: Optional DB-9 COM serial port (installs in a slot)
  • Internal

  • All models: 1x USB 3.1 G1 connector for operating system or license key purposes

Expansion Slots

  • Up to 6x PCIe Gen5 x16 adapters (2 front, 4 rear)
  • 1x OCP NIC 3.0 (x16/x8/x4) (rear) depending on the configuration

GPUs

    Supports up to 8x double-wide PCIe GPUs or 4x SXM5 GPUs, depending on the configuration:

    SXM5 model:

  • 4x SXM5 GPUs (@600W/GPU) with Lenovo Neptune liquid-to-air cooling and 4x 2.5-inch drive bays or 4x EDSFF E3.S 1T NVMe SSDs
  • 4-DW GPU model:

  • 4x double-wide GPUs with 8x 2.5-inch drive bays
  • 8-DW GPU model:

  • 8x double-wide GPUs with 6x EDSFF E1.S NVMe SSDs or 4x EDSFF E3.S 1T NVMe SSDs

Dimensions

    Height: 131 mm (5.2 inches)
    Width: 448 mm (17.6 inches)
    Depth: 892 mm (35.1 inches)
    Approximate weight, dependent on the configuration selected:
  • SXM5 model: 39.5 kg (87 lb)
  • 4-DW GPU model: 36.7 kg (81 lb)
  • 8-DW GPU model: 39 kg (86 lb)

Management

  • Lenovo XClarity Controller

Lenovo ThinkSystem SR675 V3 Server - Documentation

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