Additional InformationThe 1127FT7-DEO-ALC places 2x dual-socket nodes inside a single 1-OU Open Compute Project (OCP) 3.0-compatible chassis. Each node features 2x AMD EPYC 9006 SP7 Series processors with a maximum thermal design power (TDP) of up to 600W under liquid cooling. A dual-processor configuration can reach 512 cores and 1024 threads per node, for a chassis total of up to 1,024 cores. Each node provides 32x DDR5 DIMM slots with up to 8TB of ECC DDR5 RDIMM or 3DS RDIMM at 8000 MT/s, or up to 8TB of ECC DDR5 MRDIMM at 12800 MT/s. Storage consists of 2x front hot-swap E1.S NVMe drive bays and 2x internal M.2 PCIe 5.0 x4 NVMe slots. An optional backplane and cabling kit are required for the E1.S bays.
Expansion options include up to 2x PCIe 6.0 x16 full-height half-length slots, 1x PCIe 6.0 x16 half-height half-length slot, and 1x OCP 3.0 SFF-compliant AIOM slot. Up to 2x CXL 3.1 x16 devices are also supported. Management is handled by an ASPEED AST2700 baseboard management controller with root-of-trust support. The BMC implements IPMI 2.0 with virtual-media-over-LAN and KVM-over-LAN capabilities. Supporting software tools include Supermicro Server Manager (SSM), Super Diagnostics Offline (SDO), Supermicro Thin-Agent Service (TAS), and SuperServer Automation Assistant (SAA). Power is delivered through a 48-54 V DC busbar that draws from shared rack-level power shelves.
*This product is sold exclusively as a completely assembled system. Minimum configuration requires 2x processors, 4x DIMMs, 1x network adapter (AIOM or standard PCIe NIC), and 1x drive.
Explore available configurations for the Supermicro FlexTwin SuperServer 1127FT7-DEO-ALC. Each configuration includes a specific combination of components and options to meet different performance, cooling, storage, and deployment requirements.
- Dual AMD EPYC 9006 SP7 Series Processors
- Up to 512C/1024T
- Supports up to 600W TDP CPUs (Liquid Cooled)
- Motherboard: Super H15DPT-F
- Slot Count: 32 DIMM slots
- Max Memory (1DPC): Up to 8TB 8000MT/s ECC DDR5 RDIMM/3DS RDIMM
- Max Memory (1DPC): Up to 8TB 12800MT/s ECC DDR5 MRDIMM
Option A: Total 2 bays
- 2x front hot-swap E1.S NVMe drive bays
M.2:
- 2x M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110)
PCIe Configuration
Default:
- 1x PCIe 6.0 x16 FHHL slot
Option A
- 1x PCIe 6.0 x16 FHHL slot
- 1x PCIe 6.0 x16 HHHL slot
Option B
- 1x PCIe 6.0 x16 FHHL slot
- 1x PCIe 6.0 x16 AIOM slot (OCP 3.0 compatible)
Option C
- 2x PCIe 6.0 x16 FHHL slots
- 1x PCIe 6.0 x16 AIOM slot (OCP 3.0 compatible)
CXL Support:
- Up to CXL 3.1 x16 devices
- LAN: 1x RJ45 1 GbE Dedicated BMC LAN port
- USB: 1x USB 3.0 Type-A port (Front)
- Video: 1x mini-DP port
- TPM: 1x TPM header
- BIOS Type: AMI 64MB SPI Flash EEPROM
- BIOS Features:
- Plug and Play (PnP)
- UEFI 2.8
- USB Keyboard support
- ACPI 6.5
- SMBIOS 3.7 or later
Software:
- Supermicro Server Manager (SSM)
- Super Diagnostics Offline (SDO)
- KVM with dedicated LAN
- IPMI 2.0
- Supermicro Thin-Agent Service (TAS)
- SuperServer Automation Assistant (SAA)
- 8x counter-rotating 40x40x56mm Fan(s)
- 1x Air Shroud
- Direct to Chip (D2C) Cold Plate Liquid Cooling
- Power via Busbar (48-54V DC)
Form Factor:
- 1OU Rackmount
Height:
- 1.89" (48 mm)
Width:
- 21.14" (537 mm)
Depth:
- 33.66" (855 mm)
Weight:
- Gross Weight: 89 lbs (40.37 kg)
- Net Weight: 58.5 lbs (26.54 kg)
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