Product Details:
             NVIDIA A40 GPU ACCELERATOR 48GB 10752 CUDA CORES MEMORY INTERFACE 384 BIT GDDR6 MEMORY BANDWIDTH 696GB/S PCI-E 4.0 X16 ( 3 ) THREE DISPLAYPORTS DP GENERAL PURPOSE GRAPHICS PROCESSING UNIT GPGPU - AMPERE TECHNOLOGY PASSIVE HEATSINK   
MANUFACTURER: NVIDIA  
PART NUMBER: 900-2G133-0000-000 
 ENGINE SPECS: 
ENGINE ARCHITECTURE: AMPERE  
CUDA CORES: 10,752  
TENSOR CORES: 336 ( 3RD GEN )  
RT CORES: 84 ( 2ND GEN )  
GPU CLOCK ( BASE ): 1305 MHZ 
BOOST CLOCK: 1740 MHZ 
PEAK FP32 TFLOPS PERFORMANCE ( NON TENSOR ): 37.4 ( TERAFLOPS )  
PEAK FP16 TENSOR TFOPS WITH FP16 ACCUMULATE PERFORMANCE: 149.7 TFLOPS / 299.4 TFLOPS ( TERAFLOPS )  
PEAK TF32 TENSOR PERFORMANCE: 74.8 TFLOPS / 169.6 TFLOPS ( TERAFLOPS )  
RT CORE PERFORMANCE: 73.1 TFLOPS ( TERAFLOPS )   
PEAK BF16 TENSOR TFLOPS WITH FP32 ACCUMULATE: 149.7 TFLOPS ( TERAFLOPS ) / 299.4 TFLOPS ( TERAFLOPS )  
INTEGER PERFORMANCE: INT8 299.3 TOPS / 598.6 TOPS; INT4 598.7 TOPS / 1197.4 TOPS  
NVLINK TRANSFER SPEEDS: 112.5GB/S ( BI-DIRECTIONAL ) 
 MEMORY: 
MEMORY CONFIGURATION: 48GB 
MEMORY INTERFACE: GDDR6 
MEMORY INTERFACE WIDTH: 384 BIT 
MEMORY BANDWIDTH: 696GB/S 
MEMORY CLOCK: 7251 MHZ 
ERROR CORRECTION CODE ( ECC ): YES ( ENABLED BY DEFAULT / CAN BE DISABLED VIA SOFTWARE )  
 SUPPORT: 
BUS SUPPORT:  PCI-E 4.0 
PHYSICAL BUS INTERFACE: PCI-E 4.0 X16 
SUPPORTED TECHNOLOGIES: NVIDIA CUDA CORE TECHNOLOGY, DIRECTCOMPUTE, OPENCL, OPENACC, DIRECTX 12.07, SHADER MODEL 5.17, OPENGL 4.68, VULKAN 1.18, LEVEL 3 NEBS READY, NVIDIA VP / VAPPS SUPPORTED, NVIDIA RTX VIRTUAL WORKSTATION SUPPORTED, NVIDIA VIRTUAL COMPUTE SERVER SUPPORTED 
OPERATING SYSTEMS: MICROSOFT WINDOWS 2016, MICROSOFT WINDOWS SERVER 2019, MICROSOFT WINDOWS SERVER 2008 R2, MICROSOFT WINDOWS SERVER 2012 R2, LINUX ( ENGLISH US / UK )  
 CONNECTIONS: 
DISPLAY CONNECTORS: ( 3 ) THREE DISPLAYPORTS DP    
POWER CONNECTORS: ( 1 ) ONE 8 PIN AUXILIARY POWER CONNECTOR  
ADDITIONAL: ( 1 ) ONE NVLINK INTERFACE ( 3RD GEN ) 
THERMAL AND POWER SPECS: 
MAX POWER CONSUMPTION ( W ): 300W 
 COOLING SYSTEM: 
 PASSIVE HEATSINK ( BIDIRECTIONAL AIRFLOW ) 
 FORM FACTOR: 
 DUAL SLOT, FULL HEIGHT / HIGH PROFILE  
 DIMENSIONS: 
 4.4 INCH ( H ) ( MEASUREMENT INCLUDES PCIE INTERFACE ) X 10.5 INCH ( L )